The experimental set up related to this kind of analysis give the possibility to characterize the materials by the study of the response versus temperature of some physical parameters like the heat exchanged with the environment, the specific heat, the elastic modulus, the mechanical properties, the weight, the electric resistivity, the Seebeck coefficient. These investigation allows to correlate these physical parameters with the microstructural conditions of the material and give the principal characterization parameters useful for the preparation of new systems and for the design to develop new applications.
The materials studied in this laboratory are principally metallic and thermoelectric materials, but the kind of characterization available in this laboratory are wide and relevant for all materials. By this instruments it is possible to program many kind of measurement protocols, varying both temperature and stress and strain conditions applied.

    • DSC SEIKO 220 C, range of T: -100;650°C
    • DMA TA Instruments Q800, range of T: -150°C-600°C, Load cell of 18N, test configurations: tensile, two or three point flexion cantilever, three point bending
    • DSC TA Instruments Q100, range of T: -150°C-400°C with possibilty of MDSC (Modulated DSC)
    • TG/DTA TA Instruments SDTQ600, range of T:25°C-1500°C
    • BURSTER RESISTOMAT® typ 2305 for electric resistivity measures
    • Equipment for mechanical test MTS 2/M with thermal chamber (load cell of 2KN and 10KN, test configuration: traction, compression, two point cantilever flexion, three point bending)
    • MMR Technologies Seebeck Effect Measurement System (model SB 100) MMR Technologies Hall and Van Der Pauw Measurement System (model H 50),with possibility of different method of measure, with 2 and 4 contact, and Van Der Pauw, range of T: -200°C - 450°C

    • A. Nespoli, F. Passaretti, F. Stortiero, E. Villa
      Temperature Modulated Differential Scanning Calorimetry for the study of reversing and non-reversing heat flow of shape memory alloys
      Journal of Thermal Analysis and Calorimetry, Vol.116, Issue 2, 771-777, (2014)